Slicing Machine |
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Product name:Slicing Machine |
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Item:GI 100 |
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Details: |
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Application: For high accuracy cutting semiconductor, rare magnet,crystal,lithium tantalate,optical glass,ceramic, quartz and other brittle materials into slices. Features: 1. Main spindle system: Vertical spindle structure,adopt high accurate roller bearing. 2. Worktable: X-axis (cutting horizontal motion) adopt the accurate linear guide and the AC servo system. 3. Feeding system: Z-axis (feeding vertical motion) adopt the accurate linear guide, the ball screw and AC servo, raster control. 4. Frequency conversion, which controls spindle motor, make the machine start smoothly and work stably 5. Color touch screen can be operated flexibly. 6. PLC controller can improve the reliability of the system. Technical Data: Working range(mm): work-piece diameter: Max.100 work-piece length: Max.300 Blade(OD x ID)(mm): 422*152*0.15 Worktable feed speed (cutting speed) (mm/min): 0.1 - 90 Worktable return speed (mm/min): 1 - 999 Feed step deviation(mm): +/-0.005 (feed 1mm) Slice thickness setting resolution(mm):0.001 Slice thickness setting range (mm): 0.001 - 70.000 Crystal orientation adjustment(Z-axis): horizontal (X): +/- 5°; vertical (Y): +/- 5° Spindle speed (r/min): 2100 Power: 2.5KW Dimension(mm): 1200*700*2400 Weight: 1100kg |
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