FULAN OPTICS MACHINE CO., LTD.

   
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Slicing Machine

Slicing Machine

Product name:Slicing Machine

Item:GI 100

Details:

Application:
For high accuracy cutting semiconductor, rare magnet,crystal,lithium tantalate,optical glass,ceramic, quartz and other brittle materials into slices.

Features:
1. Main spindle system: Vertical spindle structure,adopt high accurate roller bearing.
2. Worktable: X-axis (cutting horizontal motion) adopt the accurate linear guide and the AC servo system.
3. Feeding system: Z-axis (feeding vertical motion) adopt the accurate linear guide, the ball screw and AC servo, raster control.
4. Frequency conversion, which controls spindle motor, make the machine start smoothly and work stably
5. Color touch screen can be operated flexibly.
6. PLC controller can improve the reliability of the system.
 
Technical Data:
Working range(mm): work-piece diameter:  Max.100
work-piece length: Max.350
Blade(OD x ID)(mm):  422*152*0.15
Worktable feed speed (cutting speed) (mm/min): 0.2 - 90
Worktable return speed (mm/min): 1 - 999
Feed step deviation(mm): +/-0.006 (feed 1mm)
Slice thickness setting resolution(mm):0.001
Slice thickness setting range (mm): 0.001 - 40.000
Crystal orientation adjustment(Z-axis):   horizontal (X): +/- 7°;   vertical (Y): +/- 7°
Spindle speed (r/min): 2100
Power: 2.5KW
Dimension(mm): 1200*700*2400
Weight: 1100kg

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