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Name: David
Tel: +86-25-84620580
Fax: +86-25-84529611
Mobile: +86-15335180795
E-mail: sales@opticsmachine.com
Add: No.39, Xin Zhuang,Longpan Road, Nanjing 210037,P.R.China
Tel: +86-25-84620580
Fax: +86-25-84529611
Mobile: +86-15335180795
E-mail: sales@opticsmachine.com
Add: No.39, Xin Zhuang,Longpan Road, Nanjing 210037,P.R.China
Products
Double Sided Lapping & Polishing Machine |
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Product name：Double Sided Lapping & Polishing Machine |
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Item：DS-16B3M5P-CL |
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Details： |
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Application: This machine is mainly used for double-sided high precision lapping/polishing of sapphire, optical glass, ceramics, electronic materials and silicon, germanium, computer disks and other metal and non-metallic hard and brittle materials.Mainly used for high-precision double-sided lapping and polishing of optical glass, sapphire, ceramic, crystals, semiconductors, and other hard and brittle materials.Especially for the processing of ultra-thin workpieces. Main feature: 1.Three motors are used for driving. That is, the upper/lower plate, gear ring and sun gear are all driven by independent motor. Each operation can be set separately (speed, direction) to facilitate user process setting. 2.The lower plate adopts imported bearings, which can withstand large pressure, high rotary accuracy, stable operation and long service life. 3.The sun gear and gear ring adopt synchronous lifting structure, and the lifting height (within the stroke range) can be set arbitrarily in the operation interface according to the process need. 4.The upper plate adopts double cylinders structure. The electrical proportional valve adjusts the positive pressure, and the load sensor is selected to detect the force of the workpiece at any time, and the signal is fed back to the control unit to form a closed-loop pressure control, and the pressure control is accurate. 5.The machine has the function of automatic weighing on the upper plate, which can eliminate the pressure instability caused by the wear of the upper plate in combination with the pressure setting. Thus, the processing efficiency under the same process parameters remains unchanged. 6.The frequency converter is selected for speed control, which realizes the smooth transition of starting and stopping and meets the process requirements of polishing. 7.This machine is controlled by programmable controller (PLC). The programmable terminal (PT) displays and sets the working parameters and working status. 8.The machine can be set by the user to store twelve sets of different process parameters (pressure, time, speed, ratio, slow-down pressure, floating time, etc.) for the operator to call. 9.The sun gear of the machine can run forward or reverse (relative to the gear ring and the lower plate, selected on the first screen of the human-machine interface). 10.The main reducer adopts the new structure of reducer, which has large transmission torque, high running accuracy, small noise and good stability. 11.The key structural parts of the machine are cast, with compact and reasonable structure. The equipment runs stably at high speed and heavy load, with small main vibration, which is especially suitable for high precision product processing. 12.The whole machine is a H-frame structure. When the upper plate rises to the highest position, the safety cylinder acts and the safety hook automatically locks to ensure safety and reliability. Technical Data: 1. Lower plate: size: Ø1112* Ø380*50mm (Lapping); Ø1149* Ø343*50mm (Polishing) speed: 0 - 50rpm drive motor: 11kw 2.Upper plate: size: Ø1112* Ø380*50mm (Lapping); Ø1149* Ø343*50mm (Polishing) speed: 0 - 17rpm pressure: 10 - 500kg 3.Carrier: parameter: Z=200, DP12, α= 20 ° quantity: 5 4.Sun gear: speed: 0-17rpm drive motor: 1.5 kw 5.Gear ring: lifting stroke: 30mm speed: 0-16rpm drive motor: 3 kw 6.Slurry supply device: pump motor 250w volume: 50L 7.Precision: lower plate end face runout ≤ 0.02mm flatness of upper and lower plates ≤ 0.02mm 8.Processing scope: Max. machining size: Ø380mm Min. machining thickness: 0.5mm Max. machining thickness: 30mm Capacity: 4*5=20pcs (6 " wafer); 5*5=25pcs (5 " wafer). 9.Power: 16.5 KW 10.Dimensions: (L*W*H) 2400*1500*2700mm 11.Weight: approx. 5600 kg |
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